KUALA LUMPUR: Dagang NeXchange Bhd's (DNeX) strategic investment arm, SilTerra Malaysia Sdn Bhd is offering a new manufacturing technology for microelectromechanical systems (MEMS) and photonics devices.
The innovation is based on Cavity Silicon-On-Insulator (C-SOI) wafers produced and customised by Okmetic, a high value-added silicon wafer supplier based in Finland.
DNeX said the technology also offers a precise, high yield and faster time to market MEMS and photonics devices fabrication to customers.
Group managing director Tan Sri Syed Zainal Abidin Syed Mohamed Tahir said DNeX was pleased for SilTerra as one of the early adopters in pure play foundry to introduce C- SOI-based technology for MEMS and photonics devices.
"This offering will strengthen and broaden SilTerra's offerings in this market. Moving forward, we will continue to invest and enhance our technical offerings to satisfy the market demand," he said in a statement today.
Syed Zainal Abidin, who is also SilTerra executive chairman, said the new offering was part of DNeX''s commitment to turn the former into a world-class specialty foundry player in terms of operational excellence and technology advancement.
He said demand for semiconductor chips would remain elevated this year, on the back of major technological shifts occurring around the globe such as the 5G network transition, Industry 4.0, rapid adoption of electric vehicles, and renewable energy.
"These macro trends would persist in the coming years, not only in 2022 and these will provide vast business opportunities to the local technology companies, which help fortify Malaysia's standing in the global electrical and electronics (E&E) industry.
"Local tech firms, including SilTerra, are well-poised to ride on the growth trajectory," he added.
C-SOI wafers are customised for SilTerra's needs and suitable for applications in piezosensor, micromirror, accelerometer, microphone, inertial MEMS, resonator and microfluidic devices across such vertical markets as consumer, medical, industrial and automotive for the frequency range of 500kHz or below.
The technology can also be used to build sensors that use MEMS-based actuation and Photonic-based sensing.