KUALA LUMPUR: Globetronics Technology Bhd has formed a partnership with ChipMOSTechnologies Inc (ChipMOS), a provider of semiconductor assembly and testing services headquartered in Taiwan.
ChipMOS is a leader, listed in both Taiwan and Nasdaq, in semiconductor assembly and testing services, specialising in memory and mixed-signal integrated circuit testing and advanced packaging.
ChipMOS serves a wide array of international customers in the semiconductor supply chain, providing tailored solutions to meet their precise needs.
Under the agreement, Globetronics will provide cutting-edge dicing, packaging, and testing services for integrated circuit products delivered by ChipMOS.
ChipMOS, as the supplier of these products, will be responsible for furnishing Globetronics with the necessary wafers, detailed specifications and production forecasts to facilitate efficient processing.
"This partnership is expected to strengthen both companies' capabilities in semiconductor backend services, enabling the delivery of high-quality solutions to meet the growing demands of the global market," Globetronics said.
"The collaboration leverages the strengths of both Globetronics' advanced packaging and testing expertise and ChipMOS's market leadership in integrated circuit manufacturing."
It added that with a total estimated contract value for the three-year agreement amounting to a minimum of RM145 million, the partnership aims to enhance production efficiency and product quality, solidifying their competitive positions in the semiconductor supply chain.